Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | 2013310-2 |
|---|---|
| Manufacturer: | TE Connectivity AMP Connectors |
| Product Category: | Memory Connectors - Inline Module Sockets |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 204 Position SODIMM DDR3 SDRAM Socket Surface Mount, 25° Angle |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | 2013310-2 Datasheet |
| Internal Part Number | 898-2013310-2 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| RoHS Information | 2013310-2 Statement of Compliance RoHS 2 Statement | |
| 3D Model | 2013310-2.pdf | |
| Category | Connectors, Interconnects | |
| Family | Memory Connectors - Inline Module Sockets | |
| Manufacturer | TE Connectivity AMP Connectors | |
| Series | - | |
| Packaging | Tray | |
| Part Status | Active | |
| Connector Style | SODIMM | |
| Number of Positions | 204 | |
| Memory Type | DDR3 SDRAM | |
| Standards | - | |
| Mounting Type | Surface Mount, 25° Angle | |
| Features | Board Guide, Latches | |
| Mounting Feature | Normal, Standard - Top | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 10µin (0.25µm) | |
| Standard Package | 200 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | 2013310-2 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
2013310-2 is in stock for immediate shipping now. We are the distributor of TE Connectivity AMP Connectors all series components. The condition of 2013310-2 is new and unused, you can buy 2013310-2 TE Connectivity AMP Connectors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 2013310-2.
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