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DSPIC33EP32GP504T-E/ML

DSPIC33EP32GP504T-E/ML
Manufacturer Part Number:DSPIC33EP32GP504T-E/ML
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 60 MIPs 32KB (10.7K x 24) FLASH 44-QFN (8x8)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):Obsolete / Discontinued
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: DSPIC33EP32GP504T-E/ML Datasheet
DSPIC33EP32GP504T-E/ML´s Parameters
Internal Part Number898-DSPIC33EP32GP504T-E/ML
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationMultiple Devices Datasheet Revision 20/Aug/2013
Multiple Devices Errata Revision 20/Aug/2013
Errata Document Revision 27/Sep/2013
Errata Update 06/Feb/2014
Errata/Datasheet Update 10/Apr/2014
Errata/Datasheet Update 07/Aug/2014
Errata/Datasheet Update 23/Dec/2014
PCN Assembly/OriginQualification Assembly Site 01/May/2014
Qualification Report 01/Jul/2014
PCN PackagingReel Design Update 07/May/2015
Label and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesdsPIC™ 33EP
PackagingTape & Reel (TR)
Part StatusObsolete
Core ProcessordsPIC
Core Size16-Bit
Speed60 MIPs
ConnectivityCAN, I²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O35
Program Memory Size32KB (10.7K x 24)
Program Memory TypeFLASH
EEPROM Size-
RAM Size2K x 16
Voltage - Supply (Vcc/Vdd)3 V ~ 3.6 V
Data ConvertersA/D 9x10b/12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Package / Case44-VQFN Exposed Pad
Supplier Device Package44-QFN (8x8)
Standard Package 1,600
Weight0.001 KG
ApplicationEmail for details
Replacement PartDSPIC33EP32GP504T-E/ML
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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