Manufacturer Part Number: | ESR18EZPF2260 |
---|---|
Manufacturer: | Rohm Semiconductor |
Product Category: | Chip Resistor - Surface Mount |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | RES SMD 226 OHM 1% 1/3W 1206 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | ESR18EZPF2260 Datasheet |
Internal Part Number | 898-ESR18EZPF2260 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Resistor Products Overview Anti-Surge ESR Series Resistors | |
Featured Product | ROHM Chip Resistors | |
EDA / CAD Models | Download from Accelerated Designs | |
Category | Resistors | |
Family | Chip Resistor - Surface Mount | |
Manufacturer | Rohm Semiconductor | |
Series | ESR | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Resistance (Ohms) | 226 | |
Tolerance | ±1% | |
Power (Watts) | 0.333W, 1/3W | |
Composition | Thick Film | |
Features | Automotive AEC-Q200, Pulse Withstanding | |
Temperature Coefficient | ±100ppm/°C | |
Operating Temperature | -55°C ~ 155°C | |
Package / Case | 1206 (3216 Metric) | |
Supplier Device Package | 1206 | |
Size / Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) | |
Height | 0.026" (0.65mm) | |
Number of Terminations | 2 | |
Standard Package | 5,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | ESR18EZPF2260 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
ESR18EZPF2260 is in stock for immediate shipping now. We are the distributor of Rohm Semiconductor all series components. The condition of ESR18EZPF2260 is new and unused, you can buy ESR18EZPF2260 Rohm Semiconductor with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for ESR18EZPF2260.
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