Manufacturer Part Number: | HTSW-102-08-G-D-LA |
---|---|
Manufacturer: | Samtec Inc. |
Product Category: | Rectangular Connectors - Headers, Male Pins |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 4 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole, Right Angle Gold |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | HTSW-102-08-G-D-LA Datasheet |
Internal Part Number | 898-HTSW-102-08-G-D-LA | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Male Pins | |
Manufacturer | Samtec Inc. | |
Series | HTSW | |
Packaging | Tube | |
Part Status | Active | |
Contact Type | Male Pin | |
Connector Type | Header, Unshrouded | |
Number of Positions | 4 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 2 | |
Row Spacing | 0.100" (2.54mm) | |
Contact Mating Length | 0.230" (5.84mm) | |
Mounting Type | Through Hole, Right Angle | |
Termination | Kinked Pin, Solder | |
Fastening Type | - | |
Features | - | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Color | Natural | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | HTSW-102-08-G-D-LA | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
HTSW-102-08-G-D-LA is in stock for immediate shipping now. We are the distributor of Samtec Inc. all series components. The condition of HTSW-102-08-G-D-LA is new and unused, you can buy HTSW-102-08-G-D-LA Samtec Inc. with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for HTSW-102-08-G-D-LA.
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