Manufacturer Part Number: | JBB75DYFR |
---|---|
Manufacturer: | Sullins Connector Solutions |
Product Category: | Card Edge Connectors - Edgeboard Connectors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | CONN EDGE DUAL .050 DIP 150POS |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | JBB75DYFR Datasheet |
Internal Part Number | 898-JBB75DYFR | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Card Edge Connectors - Edgeboard Connectors | |
Manufacturer | Sullins Connector Solutions | |
Series | - | |
Packaging | Tube | |
Part Status | Active | |
Card Type | Non Specified - Dual Edge | |
Gender | Female | |
Number of Positions/Bay/Row | 75 | |
Number of Positions | 150 | |
Card Thickness | 0.062" (1.57mm) | |
Number of Rows | 2 | |
Pitch | 0.050" (1.27mm) | |
Features | Board Lock | |
Mounting Type | Surface Mount | |
Termination | Solder | |
Contact Material | Beryllium Copper | |
Contact Finish | Gold | |
Contact Finish Thickness | 10µin (0.25µm) | |
Contact Type | Cantilever | |
Color | Black | |
Flange Feature | - | |
Operating Temperature | -65°C ~ 150°C | |
Material - Insulation | Polyamide (PA9T), Nylon 9T | |
Read Out | Dual | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | JBB75DYFR | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
JBB75DYFR is in stock for immediate shipping now. We are the distributor of Sullins Connector Solutions all series components. The condition of JBB75DYFR is new and unused, you can buy JBB75DYFR Sullins Connector Solutions with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for JBB75DYFR.
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