Manufacturer Part Number: | M2S090-FG676 |
---|---|
Manufacturer: | Microsemi Corporation |
Product Category: | Embedded - System On Chip (SoC) |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 676-FBGA (27x27) |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | M2S090-FG676 Datasheet |
Internal Part Number | 898-M2S090-FG676 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 Lock Setting Chg 11/May/2016 Timing Chg 17/May/2016 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Manufacturer | Microsemi Corporation | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Part Status | Active | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 90K Logic Modules | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Number of I/O | 425 | |
Standard Package | 40 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | M2S090-FG676 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
M2S090-FG676 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of M2S090-FG676 is new and unused, you can buy M2S090-FG676 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for M2S090-FG676.
AQ14EM621GAJWE | 620pF 150V Ceramic Capacitor M 1111 (2828 Metric) 0.110" L x 0.110" W (2.79mm x 2.79mm) | AQ14EM621GAJWE.pdf | |
5HTP 2.5-R | FUSE CERAMIC 2.5A 250VAC 5X20MM | 5HTP 2.5-R.pdf | |
0034.3129.TR | FUSE GLASS 16A 250VAC 5X20MM | 0034.3129.TR.pdf | |
511BBA-BAAG | 125MHz ~ 169.999MHz LVDS XO (Standard) Programmable Oscillator Surface Mount 3.3V 23mA Enable/Disable | 511BBA-BAAG.pdf | |
1N4002E-E3/53 | DIODE GEN PURP 100V 1A DO204AL | 1N4002E-E3/53.pdf | |
S29GL064N90FFIS10 | IC FLASH MEM 64MBIT 64BGA | S29GL064N90FFIS10.pdf | |
STK14C88-NF45ITR | IC NVSRAM 256KBIT 45NS 32SOIC | STK14C88-NF45ITR.pdf | |
MI-22X-MW-F2 | CONVERT DC/DC 28VIN 5.2VOUT 100W | MI-22X-MW-F2.pdf | |
M12883/52-001 | CONN BACKSHELL | M12883/52-001.pdf | |
LRF3W-R020JW | RES SMD 0.02 OHM 3W 2512 WIDE | LRF3W-R020JW.pdf | |
HBM36DRAN | CONN EDGECARD 72POS R/A .156 SLD | HBM36DRAN.pdf | |
GMC44DRYS-S93 | CONN EDGECARD 88POS DIP .100 SLD | GMC44DRYS-S93.pdf | |
GMC30DTEN | CONN EDGECARD 60POS .100 EYELET | GMC30DTEN.pdf | |
M55342H06B200ARWS | RES SMD 200 OHM 0.1% 0.15W 0705 | M55342H06B200ARWS.pdf |