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| Manufacturer Part Number: | MXSMBJSAC50E3 |
|---|---|
| Manufacturer: | Microsemi Corporation |
| Product Category: | TVS - Diodes |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | TVS DIODE 50VWM 88VC DO214AA |
| Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | MXSMBJSAC50E3 Datasheet |
| Internal Part Number | 898-MXSMBJSAC50E3 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Circuit Protection | |
| Family | TVS - Diodes | |
| Manufacturer | Microsemi IRE Division | |
| Series | Military, MIL-PRF-19500 | |
| Packaging | Bulk | |
| Part Status | Active | |
| Type | Zener | |
| Unidirectional Channels | 1 | |
| Bidirectional Channels | - | |
| Voltage - Reverse Standoff (Typ) | 50V | |
| Voltage - Breakdown (Min) | 55.5V | |
| Voltage - Clamping (Max) @ Ipp | 88V | |
| Current - Peak Pulse (10/1000µs) | 5.8A | |
| Power - Peak Pulse | 500W | |
| Power Line Protection | No | |
| Applications | General Purpose | |
| Capacitance @ Frequency | 30pF @ 1MHz | |
| Operating Temperature | -65°C ~ 150°C (TJ) | |
| Mounting Type | Surface Mount | |
| Package / Case | DO-214AA, SMB | |
| Supplier Device Package | SMBJ (DO-214AA) | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | MXSMBJSAC50E3 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
MXSMBJSAC50E3 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of MXSMBJSAC50E3 is new and unused, you can buy MXSMBJSAC50E3 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MXSMBJSAC50E3.
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