Manufacturer Part Number: | T529P226M006AAE200 |
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Manufacturer: | Kemet |
Product Category: | Tantalum - Polymer Capacitors |
Available Quantity: | 15010 Pieces |
Unit Price: | Quote by Email |
Description: | 22µF Molded Tantalum - Polymer Capacitors 6V 0805 (2012 Metric) 200 mOhm 0.079" L x 0.049" W (2.00mm x 1.25mm) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | T529P226M006AAE200 Datasheet |
Internal Part Number | 898-T529P226M006AAE200 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Online Catalog | KO Cap T529 Series | |
Category | Capacitors | |
Family | Tantalum - Polymer Capacitors | |
Manufacturer | Kemet | |
Series | KO-CAP T529 | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Capacitance | 22µF | |
Tolerance | ±20% | |
Voltage - Rated | 6V | |
ESR (Equivalent Series Resistance) | 200 mOhm | |
Type | Molded | |
Operating Temperature | -55°C ~ 105°C | |
Mounting Type | Surface Mount | |
Package / Case | 0805 (2012 Metric) | |
Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
Height - Seated (Max) | 0.039" (1.00mm) | |
Lead Spacing | - | |
Manufacturer Size Code | P | |
Features | General Purpose | |
Lifetime @ Temp. | - | |
Standard Package | 3,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | T529P226M006AAE200 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
T529P226M006AAE200 is in stock for immediate shipping now. We are the distributor of Kemet all series components. The condition of T529P226M006AAE200 is new and unused, you can buy T529P226M006AAE200 Kemet with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for T529P226M006AAE200.
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