Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | WD1M164WA1T18 |
|---|---|
| Manufacturer: | JAE Electronics |
| Product Category: | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 164 Position Connector Plug, Outer Shroud Contacts Surface Mount Gold |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | Obsolete / Discontinued |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | WD1M164WA1T18 Datasheet |
| Internal Part Number | 898-WD1M164WA1T18 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Manufacturer | JAE Electronics | |
| Series | WD1 | |
| Packaging | Tray | |
| Part Status | Obsolete | |
| Connector Type | Plug, Outer Shroud Contacts | |
| Number of Positions | 164 | |
| Pitch | 0.020" (0.50mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide, Solder Retention | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 3.9µin (0.10µm) | |
| Mated Stacking Heights | 16.5mm | |
| Height Above Board | 0.677" (17.20mm) | |
| Standard Package | 18 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | WD1M164WA1T18 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
WD1M164WA1T18 is in stock for immediate shipping now. We are the distributor of JAE Electronics all series components. The condition of WD1M164WA1T18 is new and unused, you can buy WD1M164WA1T18 JAE Electronics with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for WD1M164WA1T18.
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