Stocking distributor of Electronic Components

XC7Z030-3FBG676E

XC7Z030-3FBG676E
Manufacturer Part Number:XC7Z030-3FBG676E
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 256KB 1GHz 676-FCBGA (27x27)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: XC7Z030-3FBG676E Datasheet
XC7Z030-3FBG676E´s Parameters
Internal Part Number898-XC7Z030-3FBG676E
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesPowering Series 7 Xilinx FPGAs with TI Power Management Solutions
Featured ProductZynq®-7 SoC
PCN Design/SpecificationZynq-7000 Datasheet Update 02/Jun/2014
Zynq-7000 AP Requirement 28/Sep/2015
PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
Substrate Supplier Addition 03/Nov/2014
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerXilinx Inc.
SeriesZynq®-7000
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1GHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartXC7Z030-3FBG676E
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

XC7Z030-3FBG676E is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC7Z030-3FBG676E is new and unused, you can buy XC7Z030-3FBG676E Xilinx Inc. with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for XC7Z030-3FBG676E.

Related Components of XC7Z030-3FBG676E
1.0µF Hermetically Sealed Tantalum Capacitors 50V Axial 0.135" Dia x 0.286" L (3.43mm x 7.26mm) M39003/01-5678H.pdf
130 ~ 450pF Trimmer Capacitor 175V Side Adjustment Through Hole 0.752" L x 0.375" W (19.10mm x 9.53mm) GMD31000.pdf
ASSY 2X6 MINIPAK HDE SEQ2 1892731-2.pdf
CONN EDGECARD 24POS .156 DIP SLD ABM12DRUN.pdf
33nH Unshielded Multilayer Inductor 250mA 800 mOhm Max 0402 (1005 Metric) HK100533NK-T.pdf
10µH Shielded Inductor 291mA 1.9 Ohm Max 1210 (3225 Metric) S1210R-103J.pdf
33nH Unshielded Wirewound Inductor 600mA 250 mOhm Max 0603 (1608 Metric) S0603-33NG1S.pdf
IC SRL PROGR CLK SOURCE 16-TSSOP ICS307G-03.pdf
IC DRIVER HALF-BRIDGE 8SOIC HIP2101IBZ.pdf
RES SMD 15 OHM 5% 1/8W 0805 CRCW080515R0JNEA.pdf
0.110" (2.79mm) Quick Connect Female 15.5-20 AWG Crimp Connector Non-Insulated 160668-2.pdf
RES SMD 5.6K OHM 0.1% 1/10W 0603 RG1608N-562-B-T5.pdf
RES SMD 604 OHM 0.1% 1W 1206 HRG3216P-6040-B-T5.pdf
RES ARRAY 13 RES 47K OHM 14SOIC 4814P-2-473LF.pdf