Stocking distributor of Electronic Components

XC7Z045-1FBG676C

XC7Z045-1FBG676C
Manufacturer Part Number:XC7Z045-1FBG676C
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 256KB 667MHz 676-FCBGA (27x27)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: XC7Z045-1FBG676C Datasheet
XC7Z045-1FBG676C´s Parameters
Internal Part Number898-XC7Z045-1FBG676C
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesPowering Series 7 Xilinx FPGAs with TI Power Management Solutions
Featured ProductZynq®-7 SoC
PCN Design/SpecificationZynq-7000 Datasheet Update 02/Jun/2014
Zynq-7000 AP Requirement 28/Sep/2015
PCN Assembly/OriginAdditional Wafer Fabrication 16/Dec/2013
Substrate Supplier Addition 03/Nov/2014
Online Catalog Zynq™-7000
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerXilinx Inc.
SeriesZynq®-7000
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of I/O130
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartXC7Z045-1FBG676C
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

XC7Z045-1FBG676C is in stock for immediate shipping now. We are the distributor of Xilinx Inc. all series components. The condition of XC7Z045-1FBG676C is new and unused, you can buy XC7Z045-1FBG676C Xilinx Inc. with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for XC7Z045-1FBG676C.

Related Components of XC7Z045-1FBG676C
7500pF Film Capacitor 550V 1600V (1.6kV) Polypropylene (PP), Metallized Radial 0.689" L x 0.276" W (17.50mm x 7.00mm) BFC238354752.pdf
CONN EDGECARD 30POS DIP .156 SLD GCM15DCSD.pdf
3.6mH Unshielded Molded Inductor 59mA 40 Ohm Max Axial 2500R-54G.pdf
IC FEMTOCLOCK HCSL/MLVDS 56VFQFN 8714008DKILF.pdf
PIC PIC® XLP™ 18J Microcontroller IC 8-Bit 48MHz 32KB (16K x 16) FLASH 28-SSOP PIC18LF25J50T-I/SS.pdf
LED Lighting XLamp® ML-B White, Warm 3500K 3.3V 80mA 120° 4-SMD, J-Lead Exposed Pad MLBAWT-A1-R250-000VA6.pdf
RES CHAS MNT 3.5K OHM 1% 5W 805F3K5.pdf
CONN EDGECARD 70POS .100 R/A PCB RSC35DRAI-S734.pdf
DSUB 9 F CRIMP CLIN G TIN DEUE9ST.pdf
17 (15 + 2 Power) Position D-Sub, Combo Plug, Male Pins Connector, Free Hanging (In-Line) Solder Cup DB17W2PA00LF.pdf
CONN SOCKET 22-26AWG 15AU CRIMP 102548-3.pdf
11 Circuit 0.375" (9.53mm) Barrier Block Connector, Screws LP202211.pdf
12 Position Terminal Block Plug, Female Sockets 90° Free Hanging (In-Line) 3045512.pdf
RES SMD 107 OHM 0.1% 1/8W 0805 RP73D2A107RBTDF.pdf
RES 10 OHM 3W 5% AXIAL FKN3WSJR-73-10R.pdf